COMPOSITION FOR POLISHING PAD AND POLISHING PAD
The composition according to an embodiment employs a mixture of curing agents, which comprises a first curing agent containing sulfur and a second curing agent containing an ester group, whereby it is possible to control the physical properties of the polishing pad as necessary.
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| creator | SEO, Jang Won YUN, Jong Wook JOENG, Eun Sun HEO, Hyeyoung |
| description | The composition according to an embodiment employs a mixture of curing agents, which comprises a first curing agent containing sulfur and a second curing agent containing an ester group, whereby it is possible to control the physical properties of the polishing pad as necessary. |
| format | Patent |
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COMPOSITIONS BASED THEREON ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; POLISHING ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210429&DB=EPODOC&CC=US&NR=2021122007A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210429&DB=EPODOC&CC=US&NR=2021122007A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEO, Jang Won</creatorcontrib><creatorcontrib>YUN, Jong Wook</creatorcontrib><creatorcontrib>JOENG, Eun Sun</creatorcontrib><creatorcontrib>HEO, Hyeyoung</creatorcontrib><title>COMPOSITION FOR POLISHING PAD AND POLISHING PAD</title><description>The composition according to an embodiment employs a mixture of curing agents, which comprises a first curing agent containing sulfur and a second curing agent containing an ester group, whereby it is possible to control the physical properties of the polishing pad as necessary.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB39vcN8A_2DPH091Nw8w9SCPD38Qz28PRzVwhwdFFw9HNBFeFhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRoaGRkYGBuaOhsbEqQIAmh4mvg</recordid><startdate>20210429</startdate><enddate>20210429</enddate><creator>SEO, Jang Won</creator><creator>YUN, Jong Wook</creator><creator>JOENG, Eun Sun</creator><creator>HEO, Hyeyoung</creator><scope>EVB</scope></search><sort><creationdate>20210429</creationdate><title>COMPOSITION FOR POLISHING PAD AND POLISHING PAD</title><author>SEO, Jang Won ; 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| language | eng |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POLISHING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING |
| title | COMPOSITION FOR POLISHING PAD AND POLISHING PAD |
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