CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS

Implementations of a clip may include a first copper layer directly bonded to a first side of a ceramic layer, a second copper layer directly bonded to a second side of the ceramic layer, the second side of the ceramic layer opposite the first side of the ceramic layer, and a plurality of channels p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOO, Inpil, TEYSSEYRE, Jerome, IM, Seungwon, EOM, JooYang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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