WINDOWED WAFER ASSEMBLIES HAVING INTERPOSERS

Windowed wafer assemblies having interposers are described. A described example integrated circuit (IC) package includes first and second dies, where at least one of the first or second dies includes an optical window with a light transmittance wavelength range between 0.1 micrometers and 1.0 millim...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Jacobs, Simon Joshua
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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