RECESS BY-PASS INTERCONNECTS
An electronic device and associated methods are disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circui...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Yap, Lee Fueng Cheah, Bok Eng Kong, Jackson Chung Peng Ooi, Kooi Chi Lee, Chan Kim |
description | An electronic device and associated methods are disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021098350A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021098350A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021098350A13</originalsourceid><addsrcrecordid>eNrjZJAJcnV2DQ5WcIrUDXAE0p5-Ia5Bzv5-fq7OIcE8DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-NNjIwMjQwNLC2NTA0dCYOFUA_48h1g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RECESS BY-PASS INTERCONNECTS</title><source>esp@cenet</source><creator>Yap, Lee Fueng ; Cheah, Bok Eng ; Kong, Jackson Chung Peng ; Ooi, Kooi Chi ; Lee, Chan Kim</creator><creatorcontrib>Yap, Lee Fueng ; Cheah, Bok Eng ; Kong, Jackson Chung Peng ; Ooi, Kooi Chi ; Lee, Chan Kim</creatorcontrib><description>An electronic device and associated methods are disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210401&DB=EPODOC&CC=US&NR=2021098350A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210401&DB=EPODOC&CC=US&NR=2021098350A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yap, Lee Fueng</creatorcontrib><creatorcontrib>Cheah, Bok Eng</creatorcontrib><creatorcontrib>Kong, Jackson Chung Peng</creatorcontrib><creatorcontrib>Ooi, Kooi Chi</creatorcontrib><creatorcontrib>Lee, Chan Kim</creatorcontrib><title>RECESS BY-PASS INTERCONNECTS</title><description>An electronic device and associated methods are disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAJcnV2DQ5WcIrUDXAE0p5-Ia5Bzv5-fq7OIcE8DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-NNjIwMjQwNLC2NTA0dCYOFUA_48h1g</recordid><startdate>20210401</startdate><enddate>20210401</enddate><creator>Yap, Lee Fueng</creator><creator>Cheah, Bok Eng</creator><creator>Kong, Jackson Chung Peng</creator><creator>Ooi, Kooi Chi</creator><creator>Lee, Chan Kim</creator><scope>EVB</scope></search><sort><creationdate>20210401</creationdate><title>RECESS BY-PASS INTERCONNECTS</title><author>Yap, Lee Fueng ; Cheah, Bok Eng ; Kong, Jackson Chung Peng ; Ooi, Kooi Chi ; Lee, Chan Kim</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021098350A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Yap, Lee Fueng</creatorcontrib><creatorcontrib>Cheah, Bok Eng</creatorcontrib><creatorcontrib>Kong, Jackson Chung Peng</creatorcontrib><creatorcontrib>Ooi, Kooi Chi</creatorcontrib><creatorcontrib>Lee, Chan Kim</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yap, Lee Fueng</au><au>Cheah, Bok Eng</au><au>Kong, Jackson Chung Peng</au><au>Ooi, Kooi Chi</au><au>Lee, Chan Kim</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RECESS BY-PASS INTERCONNECTS</title><date>2021-04-01</date><risdate>2021</risdate><abstract>An electronic device and associated methods are disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US2021098350A1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | RECESS BY-PASS INTERCONNECTS |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T19%3A10%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Yap,%20Lee%20Fueng&rft.date=2021-04-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021098350A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |