HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING

Structural combinations of TIMs and methods of combining these TIMs in semiconductor packages are disclosed. An embodiment forms the structures by selectively metallizing a backside of a semiconductor chip (chip) on chip hot spots, placing a higher performance thermal interface material (TIM) on the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chowdhury, Piyas Bal, Sikka, Kamal K, Iruvanti, Sushumna, Li, Shidong, Zitz, Jeffrey Allen, Kelly, James J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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