ULTRASONIC BONDING APPARATUS AND ULTRASONIC BONDING METHOD USING THE SAME
An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seat...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LEE, Sangduk WOO, Heeju JANG, Daehwan LEE, Hyun a PARK, Chan-Jae YOUK, Kikyung |
| description | An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021094238A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021094238A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021094238A13</originalsourceid><addsrcrecordid>eNrjZPAM9QkJcgz29_N0VnDy93Px9HNXcAwIcAxyDAkNVnD0c1HAosDXNcTDHygTDOKEeLgqBDv6uvIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDI0MDSxMjYwtHQ2PiVAEA-qMuHg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ULTRASONIC BONDING APPARATUS AND ULTRASONIC BONDING METHOD USING THE SAME</title><source>esp@cenet</source><creator>LEE, Sangduk ; WOO, Heeju ; JANG, Daehwan ; LEE, Hyun a ; PARK, Chan-Jae ; YOUK, Kikyung</creator><creatorcontrib>LEE, Sangduk ; WOO, Heeju ; JANG, Daehwan ; LEE, Hyun a ; PARK, Chan-Jae ; YOUK, Kikyung</creatorcontrib><description>An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210401&DB=EPODOC&CC=US&NR=2021094238A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210401&DB=EPODOC&CC=US&NR=2021094238A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, Sangduk</creatorcontrib><creatorcontrib>WOO, Heeju</creatorcontrib><creatorcontrib>JANG, Daehwan</creatorcontrib><creatorcontrib>LEE, Hyun a</creatorcontrib><creatorcontrib>PARK, Chan-Jae</creatorcontrib><creatorcontrib>YOUK, Kikyung</creatorcontrib><title>ULTRASONIC BONDING APPARATUS AND ULTRASONIC BONDING METHOD USING THE SAME</title><description>An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAM9QkJcgz29_N0VnDy93Px9HNXcAwIcAxyDAkNVnD0c1HAosDXNcTDHygTDOKEeLgqBDv6uvIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDI0MDSxMjYwtHQ2PiVAEA-qMuHg</recordid><startdate>20210401</startdate><enddate>20210401</enddate><creator>LEE, Sangduk</creator><creator>WOO, Heeju</creator><creator>JANG, Daehwan</creator><creator>LEE, Hyun a</creator><creator>PARK, Chan-Jae</creator><creator>YOUK, Kikyung</creator><scope>EVB</scope></search><sort><creationdate>20210401</creationdate><title>ULTRASONIC BONDING APPARATUS AND ULTRASONIC BONDING METHOD USING THE SAME</title><author>LEE, Sangduk ; WOO, Heeju ; JANG, Daehwan ; LEE, Hyun a ; PARK, Chan-Jae ; YOUK, Kikyung</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021094238A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, Sangduk</creatorcontrib><creatorcontrib>WOO, Heeju</creatorcontrib><creatorcontrib>JANG, Daehwan</creatorcontrib><creatorcontrib>LEE, Hyun a</creatorcontrib><creatorcontrib>PARK, Chan-Jae</creatorcontrib><creatorcontrib>YOUK, Kikyung</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, Sangduk</au><au>WOO, Heeju</au><au>JANG, Daehwan</au><au>LEE, Hyun a</au><au>PARK, Chan-Jae</au><au>YOUK, Kikyung</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ULTRASONIC BONDING APPARATUS AND ULTRASONIC BONDING METHOD USING THE SAME</title><date>2021-04-01</date><risdate>2021</risdate><abstract>An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2021094238A1 |
| source | esp@cenet |
| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | ULTRASONIC BONDING APPARATUS AND ULTRASONIC BONDING METHOD USING THE SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T10%3A43%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE,%20Sangduk&rft.date=2021-04-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021094238A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |