POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND POLISHING METHOD APPLYING POLISHING PAD
wherein R11 and R12 are each independently hydrogen or C1-C10 alkyl groups, and n is an integer from 1 to 30.
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| creator | MOON, Su Young SEO, Jang Won YUN, Sunghoon YUN, Jong Wook HEO, Hye Young AHN, Jaein |
| description | wherein R11 and R12 are each independently hydrogen or C1-C10 alkyl groups, and n is an integer from 1 to 30. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021094143A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021094143A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021094143A13</originalsourceid><addsrcrecordid>eNrjZEgK8PfxDPbw9HNXCHB00VHwdQ3x8HdRcPMPUvB19At1c3QOCQ0Cy6Kqc_RzQRKC6nIMCPCJxFDMw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkviQ4ONDIwMDSxNDE2MHQ2NiVMFAJvgNLA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND POLISHING METHOD APPLYING POLISHING PAD</title><source>esp@cenet</source><creator>MOON, Su Young ; SEO, Jang Won ; YUN, Sunghoon ; YUN, Jong Wook ; HEO, Hye Young ; AHN, Jaein</creator><creatorcontrib>MOON, Su Young ; SEO, Jang Won ; YUN, Sunghoon ; YUN, Jong Wook ; HEO, Hye Young ; AHN, Jaein</creatorcontrib><description>wherein R11 and R12 are each independently hydrogen or C1-C10 alkyl groups, and n is an integer from 1 to 30.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210401&DB=EPODOC&CC=US&NR=2021094143A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210401&DB=EPODOC&CC=US&NR=2021094143A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOON, Su Young</creatorcontrib><creatorcontrib>SEO, Jang Won</creatorcontrib><creatorcontrib>YUN, Sunghoon</creatorcontrib><creatorcontrib>YUN, Jong Wook</creatorcontrib><creatorcontrib>HEO, Hye Young</creatorcontrib><creatorcontrib>AHN, Jaein</creatorcontrib><title>POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND POLISHING METHOD APPLYING POLISHING PAD</title><description>wherein R11 and R12 are each independently hydrogen or C1-C10 alkyl groups, and n is an integer from 1 to 30.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgK8PfxDPbw9HNXCHB00VHwdQ3x8HdRcPMPUvB19At1c3QOCQ0Cy6Kqc_RzQRKC6nIMCPCJxFDMw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkviQ4ONDIwMDSxNDE2MHQ2NiVMFAJvgNLA</recordid><startdate>20210401</startdate><enddate>20210401</enddate><creator>MOON, Su Young</creator><creator>SEO, Jang Won</creator><creator>YUN, Sunghoon</creator><creator>YUN, Jong Wook</creator><creator>HEO, Hye Young</creator><creator>AHN, Jaein</creator><scope>EVB</scope></search><sort><creationdate>20210401</creationdate><title>POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND POLISHING METHOD APPLYING POLISHING PAD</title><author>MOON, Su Young ; SEO, Jang Won ; YUN, Sunghoon ; YUN, Jong Wook ; HEO, Hye Young ; AHN, Jaein</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021094143A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MOON, Su Young</creatorcontrib><creatorcontrib>SEO, Jang Won</creatorcontrib><creatorcontrib>YUN, Sunghoon</creatorcontrib><creatorcontrib>YUN, Jong Wook</creatorcontrib><creatorcontrib>HEO, Hye Young</creatorcontrib><creatorcontrib>AHN, Jaein</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOON, Su Young</au><au>SEO, Jang Won</au><au>YUN, Sunghoon</au><au>YUN, Jong Wook</au><au>HEO, Hye Young</au><au>AHN, Jaein</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND POLISHING METHOD APPLYING POLISHING PAD</title><date>2021-04-01</date><risdate>2021</risdate><abstract>wherein R11 and R12 are each independently hydrogen or C1-C10 alkyl groups, and n is an integer from 1 to 30.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND POLISHING METHOD APPLYING POLISHING PAD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T03%3A17%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MOON,%20Su%20Young&rft.date=2021-04-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021094143A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |