WAFER ARRANGEMENT, METHOD OF MAKING SAME AND HYBRID FILTER

WAFER ARRANGEMENT, METHOD OF MAKING SAME AND HYBRID FILTER

A wafer arrangement comprises a carrier wafer (CW) having a top surface divided into a regular pattern (RP) of first CA (SA1, ARS) and second surface areas (SA2, PES), wherein each first surface area is assigned to an adjacently applied respective separate second surface area to form together a comb...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SCHIEK, Maximilian, ROSEZIN, Roland
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Beschreibung
Zusammenfassung:A wafer arrangement comprises a carrier wafer (CW) having a top surface divided into a regular pattern (RP) of first CA (SA1, ARS) and second surface areas (SA2, PES), wherein each first surface area is assigned to an adjacently applied respective separate second surface area to form together a combined filter area. Spots of thin film piezoelectric material are bonded to the first surface areas. Circuits of LC elements (PES) are formed integrally on the second surface areas from a multi-level metallization (ML1, ML2). The LC elements of each metallization level being embedded in a dielectric.