COMPUTATIONAL METROLOGY BASED CORRECTION AND CONTROL
A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selec...
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| creator | SMORENBERG, Pieter Gerardus Jacobus RIJPSTRA, Manouk ROY, Sarathi LAMBREGTS, Cornelis Johannes Henricus KOU, Weitian GROUWSTRA, Cédric Désiré TEL, Wim Tjibbo NIEN, Chi-Fei CHEN, Chang-Wei |
| description | A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality. |
| format | Patent |
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The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; CONTROL OR REGULATING SYSTEMS IN GENERAL ; CONTROLLING ; ELECTROGRAPHY ; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS ; HOLOGRAPHY ; MATERIALS THEREFOR ; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; REGULATING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210318&DB=EPODOC&CC=US&NR=2021080837A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210318&DB=EPODOC&CC=US&NR=2021080837A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SMORENBERG, Pieter Gerardus Jacobus</creatorcontrib><creatorcontrib>RIJPSTRA, Manouk</creatorcontrib><creatorcontrib>ROY, Sarathi</creatorcontrib><creatorcontrib>LAMBREGTS, Cornelis Johannes Henricus</creatorcontrib><creatorcontrib>KOU, Weitian</creatorcontrib><creatorcontrib>GROUWSTRA, Cédric Désiré</creatorcontrib><creatorcontrib>TEL, Wim Tjibbo</creatorcontrib><creatorcontrib>NIEN, Chi-Fei</creatorcontrib><creatorcontrib>CHEN, Chang-Wei</creatorcontrib><title>COMPUTATIONAL METROLOGY BASED CORRECTION AND CONTROL</title><description>A method for determining a correction to a patterning process. 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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTROGRAPHY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS HOLOGRAPHY MATERIALS THEREFOR MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS REGULATING |
| title | COMPUTATIONAL METROLOGY BASED CORRECTION AND CONTROL |
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