Conductive Feature Formation and Structure

Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a structure includes a first dielectric layer over a substrate, a first conductive feature i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chen, Pin-Wen, Lai, Chia-Han, Hung, Min-Hsiu, Cheng, Ya-Yi, Fu, Mei-Hui
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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