PERIPHERY SHORELINE AUGMENTATION FOR INTEGRATED CIRCUITS

A multichip package may include at least a main die mounted on a substrate. The main die may be coupled to one or more transceiver dies also mounted on the substrate. The main die may include one or more universal interface blocks configured to interface with an on-package memory device or an on-pac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Schulz, Jeffrey Erik, Teh, Chee Hak, Wortman, Curtis
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY INFORMATION STORAGE PHYSICS STATIC STORES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!