ELECTRONIC DEVICE COMPRISING OPTICAL ELECTRONIC COMPONENTS AND FABRICATING PROCESS
An electronic device includes a first electronic component and a second electronic. Each electronic component includes a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chi...
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creator | RIVIERE, Jean-Michel BRECHIGNAC, Remi COFFY, Romain |
description | An electronic device includes a first electronic component and a second electronic. Each electronic component includes a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chip above the carrier substrate, and electrical connections between the electronic chip and electrical contacts of the carrier substrate. An overmolded grid encapsulates and holds the first and second electronic components. The grid is configured so that sides of the first and second electronic components are at least partially exposed. |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | ELECTRONIC DEVICE COMPRISING OPTICAL ELECTRONIC COMPONENTS AND FABRICATING PROCESS |
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