ELECTRONIC DEVICE COMPRISING OPTICAL ELECTRONIC COMPONENTS AND FABRICATING PROCESS

An electronic device includes a first electronic component and a second electronic. Each electronic component includes a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chi...

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Hauptverfasser: RIVIERE, Jean-Michel, BRECHIGNAC, Remi, COFFY, Romain
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creator RIVIERE, Jean-Michel
BRECHIGNAC, Remi
COFFY, Romain
description An electronic device includes a first electronic component and a second electronic. Each electronic component includes a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chip above the carrier substrate, and electrical connections between the electronic chip and electrical contacts of the carrier substrate. An overmolded grid encapsulates and holds the first and second electronic components. The grid is configured so that sides of the first and second electronic components are at least partially exposed.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTRONIC DEVICE COMPRISING OPTICAL ELECTRONIC COMPONENTS AND FABRICATING PROCESS
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