ELECTRONIC DEVICE COMPRISING OPTICAL ELECTRONIC COMPONENTS AND MANUFACTURING METHOD

ELECTRONIC DEVICE COMPRISING OPTICAL ELECTRONIC COMPONENTS AND MANUFACTURING METHOD

An opaque dielectric carrier and confinement substrate is formed by a stack of layers laminated on each other. The stack includes a solid back layer and a front frame having a peripheral wall and an intermediate partition which delimits two cavities located on top of the solid back layer and on eith...

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Hauptverfasser: RIVIERE, Jean-Michel, BRECHIGNAC, Remi, COFFY, Romain
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator RIVIERE, Jean-Michel
BRECHIGNAC, Remi
COFFY, Romain
description An opaque dielectric carrier and confinement substrate is formed by a stack of layers laminated on each other. The stack includes a solid back layer and a front frame having a peripheral wall and an intermediate partition which delimits two cavities located on top of the solid back layer and on either side of the intermediate partition. Electronic integrated circuit (IC) chips are located inside the cavities and mounted on top of the solid back layer. Each IC chip includes an integrated optical element. Electrical connections are provided between the IC chips and back electrical contacts of the solid back layer. Transparent encapsulation blocks are molded in the cavities to embed the IC chips.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTRONIC DEVICE COMPRISING OPTICAL ELECTRONIC COMPONENTS AND MANUFACTURING METHOD
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