PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

A package structure includes a circuit substrate, a semiconductor package, a lid structure, a passive device and a barrier structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Pan, Chih-Chien, Lu, Szu-Wei, Cheng, Li-Hui, Wei, Wen-Hsin, Kao, Chin-Fu, Hu, Hsien-Pin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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