Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectroni...
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| creator | Osborn, Philip R Sato, Hiroaki Chau, Ellis Inetaro, Kurosawa Kang, Teck-Gyu Mohammed, Ilyas Hashimoto, Kiyoaki Sakuma, Kazuo Kikuchi, Tomoyuki Haba, Belgacem Wang, Wei-Shun Masuda, Norihito |
| description | Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021050322A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021050322A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021050322A13</originalsourceid><addsrcrecordid>eNrjZHAJSEzOTkxP1fXP04UyFRyLi1Nzk3IqFcIzSzKARFGqglN-XkqxQki-gmtecmJBcWlOYklmfp5CcGlRWmJyKg8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uACrJSy2JDw02MjAyNDA1MDYycjQ0Jk4VAO-KMps</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Package-On-Package Assembly With Wire Bonds To Encapsulation Surface</title><source>esp@cenet</source><creator>Osborn, Philip R ; Sato, Hiroaki ; Chau, Ellis ; Inetaro, Kurosawa ; Kang, Teck-Gyu ; Mohammed, Ilyas ; Hashimoto, Kiyoaki ; Sakuma, Kazuo ; Kikuchi, Tomoyuki ; Haba, Belgacem ; Wang, Wei-Shun ; Masuda, Norihito</creator><creatorcontrib>Osborn, Philip R ; Sato, Hiroaki ; Chau, Ellis ; Inetaro, Kurosawa ; Kang, Teck-Gyu ; Mohammed, Ilyas ; Hashimoto, Kiyoaki ; Sakuma, Kazuo ; Kikuchi, Tomoyuki ; Haba, Belgacem ; Wang, Wei-Shun ; Masuda, Norihito</creatorcontrib><description>Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210218&DB=EPODOC&CC=US&NR=2021050322A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210218&DB=EPODOC&CC=US&NR=2021050322A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Osborn, Philip R</creatorcontrib><creatorcontrib>Sato, Hiroaki</creatorcontrib><creatorcontrib>Chau, Ellis</creatorcontrib><creatorcontrib>Inetaro, Kurosawa</creatorcontrib><creatorcontrib>Kang, Teck-Gyu</creatorcontrib><creatorcontrib>Mohammed, Ilyas</creatorcontrib><creatorcontrib>Hashimoto, Kiyoaki</creatorcontrib><creatorcontrib>Sakuma, Kazuo</creatorcontrib><creatorcontrib>Kikuchi, Tomoyuki</creatorcontrib><creatorcontrib>Haba, Belgacem</creatorcontrib><creatorcontrib>Wang, Wei-Shun</creatorcontrib><creatorcontrib>Masuda, Norihito</creatorcontrib><title>Package-On-Package Assembly With Wire Bonds To Encapsulation Surface</title><description>Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAJSEzOTkxP1fXP04UyFRyLi1Nzk3IqFcIzSzKARFGqglN-XkqxQki-gmtecmJBcWlOYklmfp5CcGlRWmJyKg8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uACrJSy2JDw02MjAyNDA1MDYycjQ0Jk4VAO-KMps</recordid><startdate>20210218</startdate><enddate>20210218</enddate><creator>Osborn, Philip R</creator><creator>Sato, Hiroaki</creator><creator>Chau, Ellis</creator><creator>Inetaro, Kurosawa</creator><creator>Kang, Teck-Gyu</creator><creator>Mohammed, Ilyas</creator><creator>Hashimoto, Kiyoaki</creator><creator>Sakuma, Kazuo</creator><creator>Kikuchi, Tomoyuki</creator><creator>Haba, Belgacem</creator><creator>Wang, Wei-Shun</creator><creator>Masuda, Norihito</creator><scope>EVB</scope></search><sort><creationdate>20210218</creationdate><title>Package-On-Package Assembly With Wire Bonds To Encapsulation Surface</title><author>Osborn, Philip R ; Sato, Hiroaki ; Chau, Ellis ; Inetaro, Kurosawa ; Kang, Teck-Gyu ; Mohammed, Ilyas ; Hashimoto, Kiyoaki ; Sakuma, Kazuo ; Kikuchi, Tomoyuki ; Haba, Belgacem ; Wang, Wei-Shun ; Masuda, Norihito</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021050322A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Osborn, Philip R</creatorcontrib><creatorcontrib>Sato, Hiroaki</creatorcontrib><creatorcontrib>Chau, Ellis</creatorcontrib><creatorcontrib>Inetaro, Kurosawa</creatorcontrib><creatorcontrib>Kang, Teck-Gyu</creatorcontrib><creatorcontrib>Mohammed, Ilyas</creatorcontrib><creatorcontrib>Hashimoto, Kiyoaki</creatorcontrib><creatorcontrib>Sakuma, Kazuo</creatorcontrib><creatorcontrib>Kikuchi, Tomoyuki</creatorcontrib><creatorcontrib>Haba, Belgacem</creatorcontrib><creatorcontrib>Wang, Wei-Shun</creatorcontrib><creatorcontrib>Masuda, Norihito</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Osborn, Philip R</au><au>Sato, Hiroaki</au><au>Chau, Ellis</au><au>Inetaro, Kurosawa</au><au>Kang, Teck-Gyu</au><au>Mohammed, Ilyas</au><au>Hashimoto, Kiyoaki</au><au>Sakuma, Kazuo</au><au>Kikuchi, Tomoyuki</au><au>Haba, Belgacem</au><au>Wang, Wei-Shun</au><au>Masuda, Norihito</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package-On-Package Assembly With Wire Bonds To Encapsulation Surface</title><date>2021-02-18</date><risdate>2021</risdate><abstract>Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Package-On-Package Assembly With Wire Bonds To Encapsulation Surface |
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