Microwave Plasma Source For Spatial Plasma Enhanced Atomic Layer Deposition (PE-ALD) Processing Tool

Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Shervegar, Avinash, Kudela, Jozef, Li, Xiaopu, Forster, John C, Dzilno, Dmitry A, Bera, Kallol, Subramani, Anantha K, Garachtchenko, Alexander V, Tanaka, Tsutomu
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Shervegar, Avinash
Kudela, Jozef
Li, Xiaopu
Forster, John C
Dzilno, Dmitry A
Bera, Kallol
Subramani, Anantha K
Garachtchenko, Alexander V
Tanaka, Tsutomu
description Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021050187A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021050187A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021050187A13</originalsourceid><addsrcrecordid>eNqNi7EKwjAUALs4iPoPD1x0KKQV0bXYFocKgda5PNKnBtK8kETFv9dBd6cb7m6aDCetPD_xQSANhhGh5btXBDV7aB1GjeZnKntDq2iAIvKoFTT4Ig8lOQ46arawklVaNOUapGdFIWh7hY7ZzJPJBU2gxZezZFlX3eGYftaegkNFlmJ_bnORZ2Irsv2uyDb_VW_U_j2v</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Microwave Plasma Source For Spatial Plasma Enhanced Atomic Layer Deposition (PE-ALD) Processing Tool</title><source>esp@cenet</source><creator>Shervegar, Avinash ; Kudela, Jozef ; Li, Xiaopu ; Forster, John C ; Dzilno, Dmitry A ; Bera, Kallol ; Subramani, Anantha K ; Garachtchenko, Alexander V ; Tanaka, Tsutomu</creator><creatorcontrib>Shervegar, Avinash ; Kudela, Jozef ; Li, Xiaopu ; Forster, John C ; Dzilno, Dmitry A ; Bera, Kallol ; Subramani, Anantha K ; Garachtchenko, Alexander V ; Tanaka, Tsutomu</creatorcontrib><description>Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210218&amp;DB=EPODOC&amp;CC=US&amp;NR=2021050187A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210218&amp;DB=EPODOC&amp;CC=US&amp;NR=2021050187A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Shervegar, Avinash</creatorcontrib><creatorcontrib>Kudela, Jozef</creatorcontrib><creatorcontrib>Li, Xiaopu</creatorcontrib><creatorcontrib>Forster, John C</creatorcontrib><creatorcontrib>Dzilno, Dmitry A</creatorcontrib><creatorcontrib>Bera, Kallol</creatorcontrib><creatorcontrib>Subramani, Anantha K</creatorcontrib><creatorcontrib>Garachtchenko, Alexander V</creatorcontrib><creatorcontrib>Tanaka, Tsutomu</creatorcontrib><title>Microwave Plasma Source For Spatial Plasma Enhanced Atomic Layer Deposition (PE-ALD) Processing Tool</title><description>Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7EKwjAUALs4iPoPD1x0KKQV0bXYFocKgda5PNKnBtK8kETFv9dBd6cb7m6aDCetPD_xQSANhhGh5btXBDV7aB1GjeZnKntDq2iAIvKoFTT4Ig8lOQ46arawklVaNOUapGdFIWh7hY7ZzJPJBU2gxZezZFlX3eGYftaegkNFlmJ_bnORZ2Irsv2uyDb_VW_U_j2v</recordid><startdate>20210218</startdate><enddate>20210218</enddate><creator>Shervegar, Avinash</creator><creator>Kudela, Jozef</creator><creator>Li, Xiaopu</creator><creator>Forster, John C</creator><creator>Dzilno, Dmitry A</creator><creator>Bera, Kallol</creator><creator>Subramani, Anantha K</creator><creator>Garachtchenko, Alexander V</creator><creator>Tanaka, Tsutomu</creator><scope>EVB</scope></search><sort><creationdate>20210218</creationdate><title>Microwave Plasma Source For Spatial Plasma Enhanced Atomic Layer Deposition (PE-ALD) Processing Tool</title><author>Shervegar, Avinash ; Kudela, Jozef ; Li, Xiaopu ; Forster, John C ; Dzilno, Dmitry A ; Bera, Kallol ; Subramani, Anantha K ; Garachtchenko, Alexander V ; Tanaka, Tsutomu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021050187A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>Shervegar, Avinash</creatorcontrib><creatorcontrib>Kudela, Jozef</creatorcontrib><creatorcontrib>Li, Xiaopu</creatorcontrib><creatorcontrib>Forster, John C</creatorcontrib><creatorcontrib>Dzilno, Dmitry A</creatorcontrib><creatorcontrib>Bera, Kallol</creatorcontrib><creatorcontrib>Subramani, Anantha K</creatorcontrib><creatorcontrib>Garachtchenko, Alexander V</creatorcontrib><creatorcontrib>Tanaka, Tsutomu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Shervegar, Avinash</au><au>Kudela, Jozef</au><au>Li, Xiaopu</au><au>Forster, John C</au><au>Dzilno, Dmitry A</au><au>Bera, Kallol</au><au>Subramani, Anantha K</au><au>Garachtchenko, Alexander V</au><au>Tanaka, Tsutomu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Microwave Plasma Source For Spatial Plasma Enhanced Atomic Layer Deposition (PE-ALD) Processing Tool</title><date>2021-02-18</date><risdate>2021</risdate><abstract>Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2021050187A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title Microwave Plasma Source For Spatial Plasma Enhanced Atomic Layer Deposition (PE-ALD) Processing Tool
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-02T16%3A07%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Shervegar,%20Avinash&rft.date=2021-02-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021050187A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true