CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF

A chip structure includes a first substrate, a second substrate, a conductive via, and a redistribution layer. The first substrate has a first inclined sidewall. The second substrate is located on a bottom surface of the first substrate, and has an upper portion and a lower portion. The lower portio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAI, Jiun-Yen, CHEN, Chia-Hsiang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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