SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE

Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first...

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Bibliographische Detailangaben

Hauptverfasser:	HAEHN, Nicholas S, HEATON, Thomas, CHAN ARGUEDAS, Sergio, CETEGEN, Edvin, JAIN, Rahul, CHO, Steve S, SINGH, Antariksh Rao Pratap, IBRAHIM, Tarek A, VEHONSKY, Jacob, NEAL, Nicholas
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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