DEVICE AND METHOD FOR MEASURING THICKNESS
A thickness measuring device includes a laser emitting a laser beam to an object in a semiconductor processing chamber, a quartz glass inside the chamber reflecting part of the laser beam and to transmit a remainder of the laser beam, a first light receiving sensor detecting an intensity of first re...
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| creator | JUNG, Sung Mook JEGAL, Mun Hyeong HWANG, Jong Jin MOON, Seung Jae YUN, Jung Ho RYU, Cheong Il |
| description | A thickness measuring device includes a laser emitting a laser beam to an object in a semiconductor processing chamber, a quartz glass inside the chamber reflecting part of the laser beam and to transmit a remainder of the laser beam, a first light receiving sensor detecting an intensity of first reflected light reflected from the quartz glass, a second light receiving sensor detecting an intensity of second reflected light transmitted through the quartz glass and reflected from the object, and a controller configured to calculate input intensity of the laser beam based on the intensity of the first reflected light, to calculate reflectivity of the object by comparing the input intensity of the laser beam with the intensity of the second reflected light, and to measure a thickness of the object by comparing the calculated reflectivity with predetermined reflectivity values for a plurality of thicknesses. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021033387A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021033387A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021033387A13</originalsourceid><addsrcrecordid>eNrjZNB0cQ3zdHZVcPRzUfB1DfHwd1Fw8w8CMh2DQ4M8_dwVQjw8nb39XIODeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRoYGxsbGFuaOhMXGqAKbSJSA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DEVICE AND METHOD FOR MEASURING THICKNESS</title><source>esp@cenet</source><creator>JUNG, Sung Mook ; JEGAL, Mun Hyeong ; HWANG, Jong Jin ; MOON, Seung Jae ; YUN, Jung Ho ; RYU, Cheong Il</creator><creatorcontrib>JUNG, Sung Mook ; JEGAL, Mun Hyeong ; HWANG, Jong Jin ; MOON, Seung Jae ; YUN, Jung Ho ; RYU, Cheong Il</creatorcontrib><description>A thickness measuring device includes a laser emitting a laser beam to an object in a semiconductor processing chamber, a quartz glass inside the chamber reflecting part of the laser beam and to transmit a remainder of the laser beam, a first light receiving sensor detecting an intensity of first reflected light reflected from the quartz glass, a second light receiving sensor detecting an intensity of second reflected light transmitted through the quartz glass and reflected from the object, and a controller configured to calculate input intensity of the laser beam based on the intensity of the first reflected light, to calculate reflectivity of the object by comparing the input intensity of the laser beam with the intensity of the second reflected light, and to measure a thickness of the object by comparing the calculated reflectivity with predetermined reflectivity values for a plurality of thicknesses.</description><language>eng</language><subject>MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; TESTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210204&DB=EPODOC&CC=US&NR=2021033387A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210204&DB=EPODOC&CC=US&NR=2021033387A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JUNG, Sung Mook</creatorcontrib><creatorcontrib>JEGAL, Mun Hyeong</creatorcontrib><creatorcontrib>HWANG, Jong Jin</creatorcontrib><creatorcontrib>MOON, Seung Jae</creatorcontrib><creatorcontrib>YUN, Jung Ho</creatorcontrib><creatorcontrib>RYU, Cheong Il</creatorcontrib><title>DEVICE AND METHOD FOR MEASURING THICKNESS</title><description>A thickness measuring device includes a laser emitting a laser beam to an object in a semiconductor processing chamber, a quartz glass inside the chamber reflecting part of the laser beam and to transmit a remainder of the laser beam, a first light receiving sensor detecting an intensity of first reflected light reflected from the quartz glass, a second light receiving sensor detecting an intensity of second reflected light transmitted through the quartz glass and reflected from the object, and a controller configured to calculate input intensity of the laser beam based on the intensity of the first reflected light, to calculate reflectivity of the object by comparing the input intensity of the laser beam with the intensity of the second reflected light, and to measure a thickness of the object by comparing the calculated reflectivity with predetermined reflectivity values for a plurality of thicknesses.</description><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB0cQ3zdHZVcPRzUfB1DfHwd1Fw8w8CMh2DQ4M8_dwVQjw8nb39XIODeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRoYGxsbGFuaOhMXGqAKbSJSA</recordid><startdate>20210204</startdate><enddate>20210204</enddate><creator>JUNG, Sung Mook</creator><creator>JEGAL, Mun Hyeong</creator><creator>HWANG, Jong Jin</creator><creator>MOON, Seung Jae</creator><creator>YUN, Jung Ho</creator><creator>RYU, Cheong Il</creator><scope>EVB</scope></search><sort><creationdate>20210204</creationdate><title>DEVICE AND METHOD FOR MEASURING THICKNESS</title><author>JUNG, Sung Mook ; JEGAL, Mun Hyeong ; HWANG, Jong Jin ; MOON, Seung Jae ; YUN, Jung Ho ; RYU, Cheong Il</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021033387A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JUNG, Sung Mook</creatorcontrib><creatorcontrib>JEGAL, Mun Hyeong</creatorcontrib><creatorcontrib>HWANG, Jong Jin</creatorcontrib><creatorcontrib>MOON, Seung Jae</creatorcontrib><creatorcontrib>YUN, Jung Ho</creatorcontrib><creatorcontrib>RYU, Cheong Il</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JUNG, Sung Mook</au><au>JEGAL, Mun Hyeong</au><au>HWANG, Jong Jin</au><au>MOON, Seung Jae</au><au>YUN, Jung Ho</au><au>RYU, Cheong Il</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE AND METHOD FOR MEASURING THICKNESS</title><date>2021-02-04</date><risdate>2021</risdate><abstract>A thickness measuring device includes a laser emitting a laser beam to an object in a semiconductor processing chamber, a quartz glass inside the chamber reflecting part of the laser beam and to transmit a remainder of the laser beam, a first light receiving sensor detecting an intensity of first reflected light reflected from the quartz glass, a second light receiving sensor detecting an intensity of second reflected light transmitted through the quartz glass and reflected from the object, and a controller configured to calculate input intensity of the laser beam based on the intensity of the first reflected light, to calculate reflectivity of the object by comparing the input intensity of the laser beam with the intensity of the second reflected light, and to measure a thickness of the object by comparing the calculated reflectivity with predetermined reflectivity values for a plurality of thicknesses.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING |
| title | DEVICE AND METHOD FOR MEASURING THICKNESS |
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