SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE, AND MANUFACTURING METHODS THEREOF

A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to...

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Bibliographische Detailangaben

Hauptverfasser:	Okahisa, Eiichiro, Hashimoto, Takuya, Kobayashi, Suguru, Uehara, Sumio, Yumoto, Kazuhito, Nakazawa, Katsuya, Matsushita, Shigeru
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY
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