SEMICONDUCTOR PACKAGE

A package-on-package type package includes a lower semiconductor package and an upper semiconductor package. The lower semiconductor package includes a first semiconductor device including a through electrode, a second semiconductor device disposed on the first semiconductor device and including a s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Seo, Sunkyoung, Jo, Chajea, Han, Sanguk, Kim, Hyoeun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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