APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

An apparatus and method for processing a substrate using plasma, which has high plasma stability and process reproducibility, is provided. The method includes providing an apparatus for processing a substrate comprising a plasma generating region and a process region separate from the plasma generat...

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Hauptverfasser: Park, Wan Jae, Oh, Dong Sub, Oh, Sehoon, Lee, Ji-Hwan, Lee, Seong Gil, Kim, Dong-Hun
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creator Park, Wan Jae
Oh, Dong Sub
Oh, Sehoon
Lee, Ji-Hwan
Lee, Seong Gil
Kim, Dong-Hun
description An apparatus and method for processing a substrate using plasma, which has high plasma stability and process reproducibility, is provided. The method includes providing an apparatus for processing a substrate comprising a plasma generating region and a process region separate from the plasma generating region, placing the substrate including a silicon layer and an oxide layer in the process region, forming a hydrogen atmosphere in the process region by providing a hydrogen-based gas to the process region without passing through the plasma generating region, generating plasma by providing a fluorine-based gas to the plasma generating region, and providing the generated plasma to the process region to selectively remove the silicon layer compared to the oxide layer.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021013049A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021013049A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021013049A13</originalsourceid><addsrcrecordid>eNrjZNB1DAhwDHIMCQ1WcPRzUfB1DfHwd1Fw8w9SCAjyd3YNDvb0c1cIDnUKDgEqcuVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRoYGhsYGJpaOhsbEqQIAYI0meg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>APPARATUS AND METHOD FOR PROCESSING SUBSTRATE</title><source>esp@cenet</source><creator>Park, Wan Jae ; Oh, Dong Sub ; Oh, Sehoon ; Lee, Ji-Hwan ; Lee, Seong Gil ; Kim, Dong-Hun</creator><creatorcontrib>Park, Wan Jae ; Oh, Dong Sub ; Oh, Sehoon ; Lee, Ji-Hwan ; Lee, Seong Gil ; Kim, Dong-Hun</creatorcontrib><description>An apparatus and method for processing a substrate using plasma, which has high plasma stability and process reproducibility, is provided. The method includes providing an apparatus for processing a substrate comprising a plasma generating region and a process region separate from the plasma generating region, placing the substrate including a silicon layer and an oxide layer in the process region, forming a hydrogen atmosphere in the process region by providing a hydrogen-based gas to the process region without passing through the plasma generating region, generating plasma by providing a fluorine-based gas to the plasma generating region, and providing the generated plasma to the process region to selectively remove the silicon layer compared to the oxide layer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210114&amp;DB=EPODOC&amp;CC=US&amp;NR=2021013049A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210114&amp;DB=EPODOC&amp;CC=US&amp;NR=2021013049A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Park, Wan Jae</creatorcontrib><creatorcontrib>Oh, Dong Sub</creatorcontrib><creatorcontrib>Oh, Sehoon</creatorcontrib><creatorcontrib>Lee, Ji-Hwan</creatorcontrib><creatorcontrib>Lee, Seong Gil</creatorcontrib><creatorcontrib>Kim, Dong-Hun</creatorcontrib><title>APPARATUS AND METHOD FOR PROCESSING SUBSTRATE</title><description>An apparatus and method for processing a substrate using plasma, which has high plasma stability and process reproducibility, is provided. The method includes providing an apparatus for processing a substrate comprising a plasma generating region and a process region separate from the plasma generating region, placing the substrate including a silicon layer and an oxide layer in the process region, forming a hydrogen atmosphere in the process region by providing a hydrogen-based gas to the process region without passing through the plasma generating region, generating plasma by providing a fluorine-based gas to the plasma generating region, and providing the generated plasma to the process region to selectively remove the silicon layer compared to the oxide layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB1DAhwDHIMCQ1WcPRzUfB1DfHwd1Fw8w9SCAjyd3YNDvb0c1cIDnUKDgEqcuVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRoYGhsYGJpaOhsbEqQIAYI0meg</recordid><startdate>20210114</startdate><enddate>20210114</enddate><creator>Park, Wan Jae</creator><creator>Oh, Dong Sub</creator><creator>Oh, Sehoon</creator><creator>Lee, Ji-Hwan</creator><creator>Lee, Seong Gil</creator><creator>Kim, Dong-Hun</creator><scope>EVB</scope></search><sort><creationdate>20210114</creationdate><title>APPARATUS AND METHOD FOR PROCESSING SUBSTRATE</title><author>Park, Wan Jae ; Oh, Dong Sub ; Oh, Sehoon ; Lee, Ji-Hwan ; Lee, Seong Gil ; Kim, Dong-Hun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021013049A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Park, Wan Jae</creatorcontrib><creatorcontrib>Oh, Dong Sub</creatorcontrib><creatorcontrib>Oh, Sehoon</creatorcontrib><creatorcontrib>Lee, Ji-Hwan</creatorcontrib><creatorcontrib>Lee, Seong Gil</creatorcontrib><creatorcontrib>Kim, Dong-Hun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Park, Wan Jae</au><au>Oh, Dong Sub</au><au>Oh, Sehoon</au><au>Lee, Ji-Hwan</au><au>Lee, Seong Gil</au><au>Kim, Dong-Hun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS AND METHOD FOR PROCESSING SUBSTRATE</title><date>2021-01-14</date><risdate>2021</risdate><abstract>An apparatus and method for processing a substrate using plasma, which has high plasma stability and process reproducibility, is provided. The method includes providing an apparatus for processing a substrate comprising a plasma generating region and a process region separate from the plasma generating region, placing the substrate including a silicon layer and an oxide layer in the process region, forming a hydrogen atmosphere in the process region by providing a hydrogen-based gas to the process region without passing through the plasma generating region, generating plasma by providing a fluorine-based gas to the plasma generating region, and providing the generated plasma to the process region to selectively remove the silicon layer compared to the oxide layer.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T04%3A43%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Park,%20Wan%20Jae&rft.date=2021-01-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021013049A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true