GLASS CERAMIC SINTERED BODY AND WIRING SUBSTRATE

A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, and silica. The content of the crystallized glass is 45 mass %...

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Hauptverfasser:	SAKAI, Kenichi, FUTAMATA, Yousuke, MIYAUCHI, Yasuharu, TAKANE, Shin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING
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creator	SAKAI, Kenichi FUTAMATA, Yousuke MIYAUCHI, Yasuharu TAKANE, Shin
description	A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, and silica. The content of the crystallized glass is 45 mass % to 85 mass %, the content of the alumina filler is 14.8 mass % to 50.1 mass % in terms of Al2O3, and the content of silica is 0.2 mass % to 4.9 mass % in terms of SiO2.
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The glass ceramic sintered body contains crystallized glass, an alumina filler, and silica. The content of the crystallized glass is 45 mass % to 85 mass %, the content of the alumina filler is 14.8 mass % to 50.1 mass % in terms of Al2O3, and the content of silica is 0.2 mass % to 4.9 mass % in terms of SiO2.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210114&DB=EPODOC&CC=US&NR=2021009463A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210114&DB=EPODOC&CC=US&NR=2021009463A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAI, Kenichi</creatorcontrib><creatorcontrib>FUTAMATA, Yousuke</creatorcontrib><creatorcontrib>MIYAUCHI, Yasuharu</creatorcontrib><creatorcontrib>TAKANE, Shin</creatorcontrib><title>GLASS CERAMIC SINTERED BODY AND WIRING SUBSTRATE</title><description>A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, and silica. The content of the crystallized glass is 45 mass % to 85 mass %, the content of the alumina filler is 14.8 mass % to 50.1 mass % in terms of Al2O3, and the content of silica is 0.2 mass % to 4.9 mass % in terms of SiO2.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBw93EMDlZwdg1y9PV0Vgj29AtxDXJ1UXDyd4lUcPRzUQj3DPL0c1cIDnUKDglyDHHlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkaGBgaWJmbGjobGxKkCALmzJxs</recordid><startdate>20210114</startdate><enddate>20210114</enddate><creator>SAKAI, Kenichi</creator><creator>FUTAMATA, Yousuke</creator><creator>MIYAUCHI, Yasuharu</creator><creator>TAKANE, Shin</creator><scope>EVB</scope></search><sort><creationdate>20210114</creationdate><title>GLASS CERAMIC SINTERED BODY AND WIRING SUBSTRATE</title><author>SAKAI, Kenichi ; FUTAMATA, Yousuke ; MIYAUCHI, Yasuharu ; TAKANE, Shin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021009463A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAI, Kenichi</creatorcontrib><creatorcontrib>FUTAMATA, Yousuke</creatorcontrib><creatorcontrib>MIYAUCHI, Yasuharu</creatorcontrib><creatorcontrib>TAKANE, Shin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAI, Kenichi</au><au>FUTAMATA, Yousuke</au><au>MIYAUCHI, Yasuharu</au><au>TAKANE, Shin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GLASS CERAMIC SINTERED BODY AND WIRING SUBSTRATE</title><date>2021-01-14</date><risdate>2021</risdate><abstract>A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, and silica. The content of the crystallized glass is 45 mass % to 85 mass %, the content of the alumina filler is 14.8 mass % to 50.1 mass % in terms of Al2O3, and the content of silica is 0.2 mass % to 4.9 mass % in terms of SiO2.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING
title	GLASS CERAMIC SINTERED BODY AND WIRING SUBSTRATE
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