LEAD FRAMES INCLUDING LEAD POSTS IN DIFFERENT PLANES

A lead frame includes a die pad having a surface, a first lead post, a first lead, a second lead post, and a second lead. The first lead post has a surface coplanar with the surface of the die pad and is in a first plane. The first lead is coupled to the first lead post. The second lead post is in a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Joanna Chye, Jo Ean, Gan, Thai Kee, Wang, Lee Shuang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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