LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE

This disclosure relates to a lead frame assembly for a semiconductor device, a semiconductor device and an associated method of manufacture. The lead frame assembly includes a die attach structure and a clip frame structure. The clip frame structure includes a die connection portion configured to co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yandoc, Ricardo Lagmay, Anderson, Dave, Brown, Adam Richard
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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