SEMICONDUCTOR DEVICES WITH SHIELD

A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Sato, Seiichiro, Matsuda, Yoshio, Nishikawa, Kenji, Ikemoto, Yoshihiko
Format: Patent
Sprache:eng
Schlagworte:
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