Aromatic Polyamide Films for Solvent Resistant Flexible Substrates

Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures>300° C. The films are cross-linked in the soli...

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Hauptverfasser: Jing, Jiaokai, Harris, Frank W, Sun, Limin, Zhang, Dong
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creator Jing, Jiaokai
Harris, Frank W
Sun, Limin
Zhang, Dong
description Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures>300° C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020399469A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020399469A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020399469A13</originalsourceid><addsrcrecordid>eNrjZHByLMrPTSzJTFYIyM-pTMzNTElVcMvMyS1WSMsvUgjOzylLzStRCEotziwuSQSy3HJSKzKTclIVgkuTikuKEktSi3kYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBkYGxpaWJmaWjoTFxqgANKTMu</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Aromatic Polyamide Films for Solvent Resistant Flexible Substrates</title><source>esp@cenet</source><creator>Jing, Jiaokai ; Harris, Frank W ; Sun, Limin ; Zhang, Dong</creator><creatorcontrib>Jing, Jiaokai ; Harris, Frank W ; Sun, Limin ; Zhang, Dong</creatorcontrib><description>Films with optical transmittance of &gt;80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures&gt;300° C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201224&amp;DB=EPODOC&amp;CC=US&amp;NR=2020399469A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201224&amp;DB=EPODOC&amp;CC=US&amp;NR=2020399469A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Jing, Jiaokai</creatorcontrib><creatorcontrib>Harris, Frank W</creatorcontrib><creatorcontrib>Sun, Limin</creatorcontrib><creatorcontrib>Zhang, Dong</creatorcontrib><title>Aromatic Polyamide Films for Solvent Resistant Flexible Substrates</title><description>Films with optical transmittance of &gt;80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures&gt;300° C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHByLMrPTSzJTFYIyM-pTMzNTElVcMvMyS1WSMsvUgjOzylLzStRCEotziwuSQSy3HJSKzKTclIVgkuTikuKEktSi3kYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBkYGxpaWJmaWjoTFxqgANKTMu</recordid><startdate>20201224</startdate><enddate>20201224</enddate><creator>Jing, Jiaokai</creator><creator>Harris, Frank W</creator><creator>Sun, Limin</creator><creator>Zhang, Dong</creator><scope>EVB</scope></search><sort><creationdate>20201224</creationdate><title>Aromatic Polyamide Films for Solvent Resistant Flexible Substrates</title><author>Jing, Jiaokai ; Harris, Frank W ; Sun, Limin ; Zhang, Dong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020399469A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>Jing, Jiaokai</creatorcontrib><creatorcontrib>Harris, Frank W</creatorcontrib><creatorcontrib>Sun, Limin</creatorcontrib><creatorcontrib>Zhang, Dong</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jing, Jiaokai</au><au>Harris, Frank W</au><au>Sun, Limin</au><au>Zhang, Dong</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Aromatic Polyamide Films for Solvent Resistant Flexible Substrates</title><date>2020-12-24</date><risdate>2020</risdate><abstract>Films with optical transmittance of &gt;80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures&gt;300° C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.</abstract><oa>free_for_read</oa></addata></record>
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subjects AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
title Aromatic Polyamide Films for Solvent Resistant Flexible Substrates
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