PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER WITH IN SITU CHAMBER CLEANING CAPABILITY

Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter sec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GUNG, TZA-JING, ALLEN, ADOLPH M, SAVANDAIAH, KIRANKUMAR NEELASANDRA, SUBRAMANI, ANANTHA K, KALATHIPARAMBIL, KISHOR, FAUNE, VANESSA, HUA, ZHONG QIANG, KRAUS, PHILIP A, ZHOU, LEI, CHONG, HALBERT, SONI, VAIBHAV
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!