PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER WITH IN SITU CHAMBER CLEANING CAPABILITY
Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter sec...
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| creator | GUNG, TZA-JING ALLEN, ADOLPH M SAVANDAIAH, KIRANKUMAR NEELASANDRA SUBRAMANI, ANANTHA K KALATHIPARAMBIL, KISHOR FAUNE, VANESSA HUA, ZHONG QIANG KRAUS, PHILIP A ZHOU, LEI CHONG, HALBERT SONI, VAIBHAV |
| description | Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield. |
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In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201217&DB=EPODOC&CC=US&NR=2020395198A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201217&DB=EPODOC&CC=US&NR=2020395198A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GUNG, TZA-JING</creatorcontrib><creatorcontrib>ALLEN, ADOLPH M</creatorcontrib><creatorcontrib>SAVANDAIAH, KIRANKUMAR NEELASANDRA</creatorcontrib><creatorcontrib>SUBRAMANI, ANANTHA K</creatorcontrib><creatorcontrib>KALATHIPARAMBIL, KISHOR</creatorcontrib><creatorcontrib>FAUNE, VANESSA</creatorcontrib><creatorcontrib>HUA, ZHONG QIANG</creatorcontrib><creatorcontrib>KRAUS, PHILIP A</creatorcontrib><creatorcontrib>ZHOU, LEI</creatorcontrib><creatorcontrib>CHONG, HALBERT</creatorcontrib><creatorcontrib>SONI, VAIBHAV</creatorcontrib><title>PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER WITH IN SITU CHAMBER CLEANING CAPABILITY</title><description>Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgI8IgM9nR29FEIcwzwD1JwcQ3wD_YM8fT3U9AICHPRVHD2cPR1cg1SCPcM8VDw9FMASobCBZ19XB39PP3cFZwdAxydPH08QyJ5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgZGBsaWpoaWFo6ExcaoACRcvtg</recordid><startdate>20201217</startdate><enddate>20201217</enddate><creator>GUNG, TZA-JING</creator><creator>ALLEN, ADOLPH M</creator><creator>SAVANDAIAH, KIRANKUMAR NEELASANDRA</creator><creator>SUBRAMANI, ANANTHA K</creator><creator>KALATHIPARAMBIL, KISHOR</creator><creator>FAUNE, VANESSA</creator><creator>HUA, ZHONG QIANG</creator><creator>KRAUS, PHILIP A</creator><creator>ZHOU, LEI</creator><creator>CHONG, HALBERT</creator><creator>SONI, VAIBHAV</creator><scope>EVB</scope></search><sort><creationdate>20201217</creationdate><title>PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER WITH IN SITU CHAMBER CLEANING CAPABILITY</title><author>GUNG, TZA-JING ; ALLEN, ADOLPH M ; SAVANDAIAH, KIRANKUMAR NEELASANDRA ; SUBRAMANI, ANANTHA K ; KALATHIPARAMBIL, KISHOR ; FAUNE, VANESSA ; HUA, ZHONG QIANG ; KRAUS, PHILIP A ; ZHOU, LEI ; CHONG, HALBERT ; SONI, VAIBHAV</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020395198A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>GUNG, TZA-JING</creatorcontrib><creatorcontrib>ALLEN, ADOLPH M</creatorcontrib><creatorcontrib>SAVANDAIAH, KIRANKUMAR NEELASANDRA</creatorcontrib><creatorcontrib>SUBRAMANI, ANANTHA K</creatorcontrib><creatorcontrib>KALATHIPARAMBIL, KISHOR</creatorcontrib><creatorcontrib>FAUNE, VANESSA</creatorcontrib><creatorcontrib>HUA, ZHONG QIANG</creatorcontrib><creatorcontrib>KRAUS, PHILIP A</creatorcontrib><creatorcontrib>ZHOU, LEI</creatorcontrib><creatorcontrib>CHONG, HALBERT</creatorcontrib><creatorcontrib>SONI, VAIBHAV</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GUNG, TZA-JING</au><au>ALLEN, ADOLPH M</au><au>SAVANDAIAH, KIRANKUMAR NEELASANDRA</au><au>SUBRAMANI, ANANTHA K</au><au>KALATHIPARAMBIL, KISHOR</au><au>FAUNE, VANESSA</au><au>HUA, ZHONG QIANG</au><au>KRAUS, PHILIP A</au><au>ZHOU, LEI</au><au>CHONG, HALBERT</au><au>SONI, VAIBHAV</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER WITH IN SITU CHAMBER CLEANING CAPABILITY</title><date>2020-12-17</date><risdate>2020</risdate><abstract>Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER WITH IN SITU CHAMBER CLEANING CAPABILITY |
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