METHODS OF REDUCING THE THICKNESS OF TEXTURED GLASS, GLASS-CERAMIC, AND CERAMIC ARTICLES WITH HIGH CONCENTRATION ALKALI HYDROXIDE AT ELEVATED TEMPERATURE
A method of modifying a substrate comprising an etching step comprising contacting one or more primary surfaces of a glass, glass-ceramic, or ceramic substrate with a solution for a time period of 20 minutes to 8 hours to generate one or more etched primary surfaces, the solution comprising over 10...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Hevner, Janette Dawn Jin, Yuhui Saltzer, JR., John Robert Li, Aize |
| description | A method of modifying a substrate comprising an etching step comprising contacting one or more primary surfaces of a glass, glass-ceramic, or ceramic substrate with a solution for a time period of 20 minutes to 8 hours to generate one or more etched primary surfaces, the solution comprising over 10 percent by weight of one or more alkali hydroxides, the solution having a temperature within the range of 100° C. to 150° C., the substrate having a thickness between the primary surfaces that decreases during the time period by 5 μm to 100 μm at a rate of 2 μm per hour or greater. The solution of the etching step does not comprise hydrogen fluoride. The one or more alkali hydroxides of the solution of the etching step can be sodium hydroxide (NaOH), potassium hydroxide (KOH), or a combination of both sodium hydroxide and potassium hydroxide. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020361811A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020361811A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020361811A13</originalsourceid><addsrcrecordid>eNqNjc0KwjAQhHvxIOo7LHhVsAridUm2zWKaSLLVepIi8SQq6Mv4ttafB_AwDMM3zPSzZ0VivI7gCwika8WuBDHUidXaUfwQoUbqDkNpMcbJ16aKAlasJoBOwy8ABmFlKcKOxYDh0oDyTpGTgMLeAdo1Wgaz18E3rAlQgCxtUbp9oWrTDb3Phlnv1J7vafTzQTYuSJSZptv1kO639pgu6XGo43w2ny2W-SrPMV_813oBaBBDng</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHODS OF REDUCING THE THICKNESS OF TEXTURED GLASS, GLASS-CERAMIC, AND CERAMIC ARTICLES WITH HIGH CONCENTRATION ALKALI HYDROXIDE AT ELEVATED TEMPERATURE</title><source>esp@cenet</source><creator>Hevner, Janette Dawn ; Jin, Yuhui ; Saltzer, JR., John Robert ; Li, Aize</creator><creatorcontrib>Hevner, Janette Dawn ; Jin, Yuhui ; Saltzer, JR., John Robert ; Li, Aize</creatorcontrib><description>A method of modifying a substrate comprising an etching step comprising contacting one or more primary surfaces of a glass, glass-ceramic, or ceramic substrate with a solution for a time period of 20 minutes to 8 hours to generate one or more etched primary surfaces, the solution comprising over 10 percent by weight of one or more alkali hydroxides, the solution having a temperature within the range of 100° C. to 150° C., the substrate having a thickness between the primary surfaces that decreases during the time period by 5 μm to 100 μm at a rate of 2 μm per hour or greater. The solution of the etching step does not comprise hydrogen fluoride. The one or more alkali hydroxides of the solution of the etching step can be sodium hydroxide (NaOH), potassium hydroxide (KOH), or a combination of both sodium hydroxide and potassium hydroxide.</description><language>eng</language><subject>ARTIFICIAL STONE ; CEMENTS ; CERAMICS ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; LIME, MAGNESIA ; METALLURGY ; MINERAL OR SLAG WOOL ; REFRACTORIES ; SLAG ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS ; TREATMENT OF NATURAL STONE</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201119&DB=EPODOC&CC=US&NR=2020361811A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201119&DB=EPODOC&CC=US&NR=2020361811A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hevner, Janette Dawn</creatorcontrib><creatorcontrib>Jin, Yuhui</creatorcontrib><creatorcontrib>Saltzer, JR., John Robert</creatorcontrib><creatorcontrib>Li, Aize</creatorcontrib><title>METHODS OF REDUCING THE THICKNESS OF TEXTURED GLASS, GLASS-CERAMIC, AND CERAMIC ARTICLES WITH HIGH CONCENTRATION ALKALI HYDROXIDE AT ELEVATED TEMPERATURE</title><description>A method of modifying a substrate comprising an etching step comprising contacting one or more primary surfaces of a glass, glass-ceramic, or ceramic substrate with a solution for a time period of 20 minutes to 8 hours to generate one or more etched primary surfaces, the solution comprising over 10 percent by weight of one or more alkali hydroxides, the solution having a temperature within the range of 100° C. to 150° C., the substrate having a thickness between the primary surfaces that decreases during the time period by 5 μm to 100 μm at a rate of 2 μm per hour or greater. The solution of the etching step does not comprise hydrogen fluoride. The one or more alkali hydroxides of the solution of the etching step can be sodium hydroxide (NaOH), potassium hydroxide (KOH), or a combination of both sodium hydroxide and potassium hydroxide.</description><subject>ARTIFICIAL STONE</subject><subject>CEMENTS</subject><subject>CERAMICS</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</subject><subject>CONCRETE</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>LIME, MAGNESIA</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>REFRACTORIES</subject><subject>SLAG</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><subject>TREATMENT OF NATURAL STONE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjc0KwjAQhHvxIOo7LHhVsAridUm2zWKaSLLVepIi8SQq6Mv4ttafB_AwDMM3zPSzZ0VivI7gCwika8WuBDHUidXaUfwQoUbqDkNpMcbJ16aKAlasJoBOwy8ABmFlKcKOxYDh0oDyTpGTgMLeAdo1Wgaz18E3rAlQgCxtUbp9oWrTDb3Phlnv1J7vafTzQTYuSJSZptv1kO639pgu6XGo43w2ny2W-SrPMV_813oBaBBDng</recordid><startdate>20201119</startdate><enddate>20201119</enddate><creator>Hevner, Janette Dawn</creator><creator>Jin, Yuhui</creator><creator>Saltzer, JR., John Robert</creator><creator>Li, Aize</creator><scope>EVB</scope></search><sort><creationdate>20201119</creationdate><title>METHODS OF REDUCING THE THICKNESS OF TEXTURED GLASS, GLASS-CERAMIC, AND CERAMIC ARTICLES WITH HIGH CONCENTRATION ALKALI HYDROXIDE AT ELEVATED TEMPERATURE</title><author>Hevner, Janette Dawn ; Jin, Yuhui ; Saltzer, JR., John Robert ; Li, Aize</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020361811A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>ARTIFICIAL STONE</topic><topic>CEMENTS</topic><topic>CERAMICS</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</topic><topic>CONCRETE</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>LIME, MAGNESIA</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>REFRACTORIES</topic><topic>SLAG</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><topic>TREATMENT OF NATURAL STONE</topic><toplevel>online_resources</toplevel><creatorcontrib>Hevner, Janette Dawn</creatorcontrib><creatorcontrib>Jin, Yuhui</creatorcontrib><creatorcontrib>Saltzer, JR., John Robert</creatorcontrib><creatorcontrib>Li, Aize</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hevner, Janette Dawn</au><au>Jin, Yuhui</au><au>Saltzer, JR., John Robert</au><au>Li, Aize</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHODS OF REDUCING THE THICKNESS OF TEXTURED GLASS, GLASS-CERAMIC, AND CERAMIC ARTICLES WITH HIGH CONCENTRATION ALKALI HYDROXIDE AT ELEVATED TEMPERATURE</title><date>2020-11-19</date><risdate>2020</risdate><abstract>A method of modifying a substrate comprising an etching step comprising contacting one or more primary surfaces of a glass, glass-ceramic, or ceramic substrate with a solution for a time period of 20 minutes to 8 hours to generate one or more etched primary surfaces, the solution comprising over 10 percent by weight of one or more alkali hydroxides, the solution having a temperature within the range of 100° C. to 150° C., the substrate having a thickness between the primary surfaces that decreases during the time period by 5 μm to 100 μm at a rate of 2 μm per hour or greater. The solution of the etching step does not comprise hydrogen fluoride. The one or more alkali hydroxides of the solution of the etching step can be sodium hydroxide (NaOH), potassium hydroxide (KOH), or a combination of both sodium hydroxide and potassium hydroxide.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2020361811A1 |
| source | esp@cenet |
| subjects | ARTIFICIAL STONE CEMENTS CERAMICS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LIME, MAGNESIA METALLURGY MINERAL OR SLAG WOOL REFRACTORIES SLAG SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TREATMENT OF NATURAL STONE |
| title | METHODS OF REDUCING THE THICKNESS OF TEXTURED GLASS, GLASS-CERAMIC, AND CERAMIC ARTICLES WITH HIGH CONCENTRATION ALKALI HYDROXIDE AT ELEVATED TEMPERATURE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T11%3A21%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Hevner,%20Janette%20Dawn&rft.date=2020-11-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2020361811A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |