METHOD FOR DIVIDING COMPOSITE MATERIAL
A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including radiating a laser light oscillated from a CO2 laser source to the resin layer along the scheduled dividing line of the composite material and thereby forming a process...
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| creator | Matsuo, Naoyuki |
| description | A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including radiating a laser light oscillated from a CO2 laser source to the resin layer along the scheduled dividing line of the composite material and thereby forming a processed groove along the scheduled dividing line; radiating a laser light oscillated from an ultrashort pulse laser source to the brittle material layer along the scheduled dividing line and thereby forming a processing mark along the scheduled dividing line; and dividing the composite material by applying an external force along the scheduled dividing line. The method is characterized in that the processing mark to be formed is perforated through holes along the scheduled dividing line, and the pitch of the through holes is 10 μm or less. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020353567A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020353567A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020353567A13</originalsourceid><addsrcrecordid>eNrjZFDzdQ3x8HdRcPMPUnDxDPN08fRzV3D29w3wD_YMcVXwdQxxDfJ09OFhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRgbGpsamZuaOhsbEqQIATqkkew</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR DIVIDING COMPOSITE MATERIAL</title><source>esp@cenet</source><creator>Matsuo, Naoyuki</creator><creatorcontrib>Matsuo, Naoyuki</creatorcontrib><description>A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including radiating a laser light oscillated from a CO2 laser source to the resin layer along the scheduled dividing line of the composite material and thereby forming a processed groove along the scheduled dividing line; radiating a laser light oscillated from an ultrashort pulse laser source to the brittle material layer along the scheduled dividing line and thereby forming a processing mark along the scheduled dividing line; and dividing the composite material by applying an external force along the scheduled dividing line. The method is characterized in that the processing mark to be formed is perforated through holes along the scheduled dividing line, and the pitch of the through holes is 10 μm or less.</description><language>eng</language><subject>CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; GLASS ; MACHINE TOOLS ; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201112&DB=EPODOC&CC=US&NR=2020353567A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201112&DB=EPODOC&CC=US&NR=2020353567A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Matsuo, Naoyuki</creatorcontrib><title>METHOD FOR DIVIDING COMPOSITE MATERIAL</title><description>A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including radiating a laser light oscillated from a CO2 laser source to the resin layer along the scheduled dividing line of the composite material and thereby forming a processed groove along the scheduled dividing line; radiating a laser light oscillated from an ultrashort pulse laser source to the brittle material layer along the scheduled dividing line and thereby forming a processing mark along the scheduled dividing line; and dividing the composite material by applying an external force along the scheduled dividing line. The method is characterized in that the processing mark to be formed is perforated through holes along the scheduled dividing line, and the pitch of the through holes is 10 μm or less.</description><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>GLASS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDzdQ3x8HdRcPMPUnDxDPN08fRzV3D29w3wD_YMcVXwdQxxDfJ09OFhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRgbGpsamZuaOhsbEqQIATqkkew</recordid><startdate>20201112</startdate><enddate>20201112</enddate><creator>Matsuo, Naoyuki</creator><scope>EVB</scope></search><sort><creationdate>20201112</creationdate><title>METHOD FOR DIVIDING COMPOSITE MATERIAL</title><author>Matsuo, Naoyuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020353567A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>GLASS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>Matsuo, Naoyuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Matsuo, Naoyuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR DIVIDING COMPOSITE MATERIAL</title><date>2020-11-12</date><risdate>2020</risdate><abstract>A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including radiating a laser light oscillated from a CO2 laser source to the resin layer along the scheduled dividing line of the composite material and thereby forming a processed groove along the scheduled dividing line; radiating a laser light oscillated from an ultrashort pulse laser source to the brittle material layer along the scheduled dividing line and thereby forming a processing mark along the scheduled dividing line; and dividing the composite material by applying an external force along the scheduled dividing line. The method is characterized in that the processing mark to be formed is perforated through holes along the scheduled dividing line, and the pitch of the through holes is 10 μm or less.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR DIVIDING COMPOSITE MATERIAL |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T21%3A54%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Matsuo,%20Naoyuki&rft.date=2020-11-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2020353567A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |