SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device includes a semiconductor chip; a heat transfer plate joined to an upper surface of the semiconductor chip; a first adhesive material provided on an upper surface of the heat transfer plate; a radiator whose lower surface is joined to the upper surface of the heat transfer plat...

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Hauptverfasser: AOKI, Michimasa, Takemura, Keizou, Yamamoto, Tsuyoshi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator AOKI, Michimasa
Takemura, Keizou
Yamamoto, Tsuyoshi
description A semiconductor device includes a semiconductor chip; a heat transfer plate joined to an upper surface of the semiconductor chip; a first adhesive material provided on an upper surface of the heat transfer plate; a radiator whose lower surface is joined to the upper surface of the heat transfer plate via the first adhesive material; a second adhesive material that is provided on an outer peripheral surface of the heat transfer plate, and joins the upper surface of the semiconductor chip and the lower surface of the radiator; and a groove that is formed on the lower surface of the radiator and extends along the outer peripheral surface of the heat transfer plate.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020328138A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020328138A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020328138A13</originalsourceid><addsrcrecordid>eNrjZCgIdvX1dPb3cwl1DvEPUnBxDfN0dtVRcPVxdQ4J8vfzdMYm5BoY6hng6-oXoqPg6Oei4Osa4uHvouAG1O_r6Bfq5ugcEhrk6eeugM1sHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBkYGxkYWhs4WhoTJwqALvdOM4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>AOKI, Michimasa ; Takemura, Keizou ; Yamamoto, Tsuyoshi</creator><creatorcontrib>AOKI, Michimasa ; Takemura, Keizou ; Yamamoto, Tsuyoshi</creatorcontrib><description>A semiconductor device includes a semiconductor chip; a heat transfer plate joined to an upper surface of the semiconductor chip; a first adhesive material provided on an upper surface of the heat transfer plate; a radiator whose lower surface is joined to the upper surface of the heat transfer plate via the first adhesive material; a second adhesive material that is provided on an outer peripheral surface of the heat transfer plate, and joins the upper surface of the semiconductor chip and the lower surface of the radiator; and a groove that is formed on the lower surface of the radiator and extends along the outer peripheral surface of the heat transfer plate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201015&amp;DB=EPODOC&amp;CC=US&amp;NR=2020328138A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201015&amp;DB=EPODOC&amp;CC=US&amp;NR=2020328138A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AOKI, Michimasa</creatorcontrib><creatorcontrib>Takemura, Keizou</creatorcontrib><creatorcontrib>Yamamoto, Tsuyoshi</creatorcontrib><title>SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><description>A semiconductor device includes a semiconductor chip; a heat transfer plate joined to an upper surface of the semiconductor chip; a first adhesive material provided on an upper surface of the heat transfer plate; a radiator whose lower surface is joined to the upper surface of the heat transfer plate via the first adhesive material; a second adhesive material that is provided on an outer peripheral surface of the heat transfer plate, and joins the upper surface of the semiconductor chip and the lower surface of the radiator; and a groove that is formed on the lower surface of the radiator and extends along the outer peripheral surface of the heat transfer plate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCgIdvX1dPb3cwl1DvEPUnBxDfN0dtVRcPVxdQ4J8vfzdMYm5BoY6hng6-oXoqPg6Oei4Osa4uHvouAG1O_r6Bfq5ugcEhrk6eeugM1sHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBkYGxkYWhs4WhoTJwqALvdOM4</recordid><startdate>20201015</startdate><enddate>20201015</enddate><creator>AOKI, Michimasa</creator><creator>Takemura, Keizou</creator><creator>Yamamoto, Tsuyoshi</creator><scope>EVB</scope></search><sort><creationdate>20201015</creationdate><title>SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><author>AOKI, Michimasa ; Takemura, Keizou ; Yamamoto, Tsuyoshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020328138A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>AOKI, Michimasa</creatorcontrib><creatorcontrib>Takemura, Keizou</creatorcontrib><creatorcontrib>Yamamoto, Tsuyoshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AOKI, Michimasa</au><au>Takemura, Keizou</au><au>Yamamoto, Tsuyoshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><date>2020-10-15</date><risdate>2020</risdate><abstract>A semiconductor device includes a semiconductor chip; a heat transfer plate joined to an upper surface of the semiconductor chip; a first adhesive material provided on an upper surface of the heat transfer plate; a radiator whose lower surface is joined to the upper surface of the heat transfer plate via the first adhesive material; a second adhesive material that is provided on an outer peripheral surface of the heat transfer plate, and joins the upper surface of the semiconductor chip and the lower surface of the radiator; and a groove that is formed on the lower surface of the radiator and extends along the outer peripheral surface of the heat transfer plate.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T08%3A11%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=AOKI,%20Michimasa&rft.date=2020-10-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2020328138A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true