METHODOLOGY FOR BLINDMATING AND COOLING ELECTRONIC MODULES

An apparatus is disclosed comprising: a chassis including an array plate, the array plate having a plurality of first openings formed thereon; a plurality of floating inserts, each of the floating inserts being disposed in a different one of the first openings; a main board having a plurality of sec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wells, Derek B, Mercier, Dennis W, Walsh, JR., Kenneth P, Renaud, Gregory S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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