COOLING OF ELECTRONIC DEVICES

COOLING OF ELECTRONIC DEVICES

A substrate includes a through cavity. A heat sink is mounted so as to close one end of the through cavity. An integrated circuit (IC) chip is also mounted in the cavity. Conductive wires provide an electrical connection between pads on an upper surface of the IC chip and metallizations on the subst...

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Hauptverfasser: COULLOMB, Alexandre, FRANIATTE, Olivier, COFFY, Romain
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator COULLOMB, Alexandre
FRANIATTE, Olivier
COFFY, Romain
description A substrate includes a through cavity. A heat sink is mounted so as to close one end of the through cavity. An integrated circuit (IC) chip is also mounted in the cavity. Conductive wires provide an electrical connection between pads on an upper surface of the IC chip and metallizations on the substrate. The mounted heat sink is positioned within the substrate in one implementation and positioned mounted to a back surface of the substrate in another implementation.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title COOLING OF ELECTRONIC DEVICES
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