Integration of EBG Structures (Single Layer/Multi-Layer) for Isolation Enhancement In Multilayer Embedded Packaging Technology at mmWave

A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna...

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Hauptverfasser:	Abdel-Aziz, Marwa, Trotta, Saverio, Dogan, Mustafa, Qureshi, Muhammad Tayyab, Wojnowski, Maciej, Baheti, Ashutosh
Format:	Patent
Sprache:	eng
Schlagworte:	ANALOGOUS ARRANGEMENTS USING OTHER WAVES ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION TESTING
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creator	Abdel-Aziz, Marwa Trotta, Saverio Dogan, Mustafa Qureshi, Muhammad Tayyab Wojnowski, Maciej Baheti, Ashutosh
description	A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna for isolating the transmit antenna and the receive antenna, the electromagnetic band gap structure including elementary cells forming adjacent columns each coupled to the ground plane, and each elementary cell including a conductive planar element and a columnar element coupled to the conductive planar element.
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subjects	ANALOGOUS ARRANGEMENTS USING OTHER WAVES ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION TESTING
title	Integration of EBG Structures (Single Layer/Multi-Layer) for Isolation Enhancement In Multilayer Embedded Packaging Technology at mmWave
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