PACKAGE INTEGRATION FOR MEMORY DEVICES

An electronic device and method for fabricating the same are disclosed herein. In one example the electronic device includes a substrate, a first die stack, and a second die stack. The first die stack includes a first functional die and a first dummy die. The first functional die is mounted to the s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chang, Cheang-Whang, Kim, Myongseob, Liu, Henley, Gandhi, Jaspreet Singh
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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