FLEXIBLE IMPEDANCE NETWORK SYSTEM

Techniques and architecture are disclosed for a method for making a custom circuit comprising forming a common wafer template, selecting at least two elements of the common wafer template to be chosen elements, and adding at least one metal layer to interconnect the chosen elements to form a circuit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Creamer, Carlton T, Lu, Hong M, Boire, Daniel C, Chu, Kanin, Schmanski, Bernard J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES TRANSMISSION
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