METHODS OF FORMING DEVICES INCLUDING MULTI-PORTION LINERS

A method of forming a semiconductor structure. The method comprises forming a protective portion of a liner on at least a portion of stack structures on a substrate. The protective portion comprises a material formulated to adhere to the stack structures. A conformal portion of the liner is formed o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Good, Farrell M, Chong, Kyuchul, Vasilyeva, Irina, Bhat, Vishwanath, Campbell, Kyle B
Format: Patent
Sprache:eng
Schlagworte:
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