CHIP-SCALE SENSOR PACKAGE STRUCTURE

CHIP-SCALE SENSOR PACKAGE STRUCTURE

A chip-scale sensor package structure includes a sensor chip, a ring-shaped support disposed on a top surface of the sensor chip, a light permeable member disposed on the ring-shaped support, a package body, and a redistribution layer (RDL). The package body surrounds outer lateral sides of the sens...

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Hauptverfasser: TU, HSIU-WEN, LEE, CHIENN, HUNG, LIUN
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TU, HSIU-WEN
LEE, CHIENN
HUNG, LIUN
description A chip-scale sensor package structure includes a sensor chip, a ring-shaped support disposed on a top surface of the sensor chip, a light permeable member disposed on the ring-shaped support, a package body, and a redistribution layer (RDL). The package body surrounds outer lateral sides of the sensor chip, the ring-shaped support and the light permeable member. A bottom surface of the sensor chip and a surface of the light permeable member are exposed from the package body. The RDL is directly formed on the bottom surface of the sensor chip and a bottom side of the package body. The RDL includes a plurality of external contacts arranged on a bottom surface thereof and electrically coupled to the sensor chip. A portion of the external contacts are arranged outside of a projection region defined by orthogonally projecting the sensor chip onto the bottom surface of the RDL.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title CHIP-SCALE SENSOR PACKAGE STRUCTURE
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