STRESS REDUCTION DURING LASER RESEALING THROUGH A TEMPERATURE INCREASE
A method for producing a micromechanical component having a substrate and a cap that are connected to each other and that enclose a first cavity, where a first pressure prevails inside the first cavity and a first gas mixture having a first chemical composition is enclosed within the first cavity, i...
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| creator | AMTHOR, Julia KAPPE, Philip AMETOWOBLA, Mawuli |
| description | A method for producing a micromechanical component having a substrate and a cap that are connected to each other and that enclose a first cavity, where a first pressure prevails inside the first cavity and a first gas mixture having a first chemical composition is enclosed within the first cavity, includes, in a first method step, developing in the substrate or cap an access opening connecting the first cavity to an environment of the micromechanical component, in a second method step, setting the first pressure and/or the first chemical composition in the first cavity, in a third method step, sealing the access opening using a laser by introduction of energy or heat into an absorbing part of the substrate or the cap, and, in a fourth method step, performing a thermal treatment of the substrate or the cap, thereby reducing temperature gradients in the substrate or in the cap. |
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| subjects | MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING |
| title | STRESS REDUCTION DURING LASER RESEALING THROUGH A TEMPERATURE INCREASE |
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