Conductive Interconnect Structures in Integrated Circuits

An interconnect structure and a method of forming the interconnect structure are provided. A dielectric layer and openings therein are formed over a substrate. A conductive seed layer is formed over the top surface and along a bottom and sidewalls of the openings. A conductive fill layer is formed o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Liao, Chi-Hung, Ou Yang, Liang-Yueh, Lien, Shao Tzu, Lee, Chin-Szu, Wu, Szu-Hua, Wu, Jung-Tang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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