LIGHT-EMITTING DEVICE PACKAGE

A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SONG, Jong-sup, CHOI, Seol-young, YUN, Ji-hoon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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