SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED DIE PAD AND SOLDER MASK DESIGN

A described example includes a package substrate having an array of die pads arranged in rows and columns on a die mount surface, and having an opposing board side surface; a solder mask layer overlying the die mount surface; a first plurality of solder mask defined openings in the solder mask layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Williamson, Jaimal Mallory, Li, Guangxu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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