POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMICONDUCTOR DEVICE

A power semiconductor device includes a substrate and a semiconductor element bonded onto a first surface of the substrate through use of a sintered metal bonding material. The substrate has a plurality of dimples formed in the first surface and located outside a location immediately below a heat ge...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MURAMATSU, Yuya, HARUNA, Hiroaki, SUGI, Yutaro, BESSHI, Noriyuki, YABUTA, Kohei, YAMADA, Takayuki, FUKU, Masaru, FUJITA, Atsuki
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!