VERTICALLY STACKED FINFETS & SHARED GATE PATTERNING

Stacked finFET structures including a fin having at least a first layer of semiconductor material stacked over or under a second layer of semiconductor material. The first and second layers may include a Group IV semiconductor material layer and a Group III-V semiconductor material layer, for exampl...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ma, Sean, Cea, Stephen M, Morrow, Patrick, Keys, Patrick H, Weber, Justin R, Lilak, Aaron, Mehandru, Rishabh
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Ma, Sean
Cea, Stephen M
Morrow, Patrick
Keys, Patrick H
Weber, Justin R
Lilak, Aaron
Mehandru, Rishabh
description Stacked finFET structures including a fin having at least a first layer of semiconductor material stacked over or under a second layer of semiconductor material. The first and second layers may include a Group IV semiconductor material layer and a Group III-V semiconductor material layer, for example. A stacked finFET may include an N-type finFET stacked over or under a P-type finFET, the two finFETs may have channel portions within the different semiconductor material layers. Channel portions of the first and second layers of semiconductor material may be coupled to separate gate electrodes that are vertically aligned. Channel portions of the first and second layers of semiconductor material may be vertically separated by subfin portions of the first and second layers. Different layers of dielectric material adjacent to the subfin portions may improve electrical isolation between the channel portions, for example as a source of fixed charge or impurity dopants.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020235013A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020235013A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020235013A13</originalsourceid><addsrcrecordid>eNrjZDAOcw0K8XR29PGJVAgOcXT2dnVRcPP0c3MNCVZQUwj2cAwCCrg7hrgqBDiGhLgG-Xn6ufMwsKYl5hSn8kJpbgZloHpnD93Ugvz41OKCxOTUvNSS-NBgIwMgNDY1MDR2NDQmThUAI9YnuQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>VERTICALLY STACKED FINFETS &amp; SHARED GATE PATTERNING</title><source>esp@cenet</source><creator>Ma, Sean ; Cea, Stephen M ; Morrow, Patrick ; Keys, Patrick H ; Weber, Justin R ; Lilak, Aaron ; Mehandru, Rishabh</creator><creatorcontrib>Ma, Sean ; Cea, Stephen M ; Morrow, Patrick ; Keys, Patrick H ; Weber, Justin R ; Lilak, Aaron ; Mehandru, Rishabh</creatorcontrib><description>Stacked finFET structures including a fin having at least a first layer of semiconductor material stacked over or under a second layer of semiconductor material. The first and second layers may include a Group IV semiconductor material layer and a Group III-V semiconductor material layer, for example. A stacked finFET may include an N-type finFET stacked over or under a P-type finFET, the two finFETs may have channel portions within the different semiconductor material layers. Channel portions of the first and second layers of semiconductor material may be coupled to separate gate electrodes that are vertically aligned. Channel portions of the first and second layers of semiconductor material may be vertically separated by subfin portions of the first and second layers. Different layers of dielectric material adjacent to the subfin portions may improve electrical isolation between the channel portions, for example as a source of fixed charge or impurity dopants.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200723&amp;DB=EPODOC&amp;CC=US&amp;NR=2020235013A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200723&amp;DB=EPODOC&amp;CC=US&amp;NR=2020235013A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ma, Sean</creatorcontrib><creatorcontrib>Cea, Stephen M</creatorcontrib><creatorcontrib>Morrow, Patrick</creatorcontrib><creatorcontrib>Keys, Patrick H</creatorcontrib><creatorcontrib>Weber, Justin R</creatorcontrib><creatorcontrib>Lilak, Aaron</creatorcontrib><creatorcontrib>Mehandru, Rishabh</creatorcontrib><title>VERTICALLY STACKED FINFETS &amp; SHARED GATE PATTERNING</title><description>Stacked finFET structures including a fin having at least a first layer of semiconductor material stacked over or under a second layer of semiconductor material. The first and second layers may include a Group IV semiconductor material layer and a Group III-V semiconductor material layer, for example. A stacked finFET may include an N-type finFET stacked over or under a P-type finFET, the two finFETs may have channel portions within the different semiconductor material layers. Channel portions of the first and second layers of semiconductor material may be coupled to separate gate electrodes that are vertically aligned. Channel portions of the first and second layers of semiconductor material may be vertically separated by subfin portions of the first and second layers. Different layers of dielectric material adjacent to the subfin portions may improve electrical isolation between the channel portions, for example as a source of fixed charge or impurity dopants.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAOcw0K8XR29PGJVAgOcXT2dnVRcPP0c3MNCVZQUwj2cAwCCrg7hrgqBDiGhLgG-Xn6ufMwsKYl5hSn8kJpbgZloHpnD93Ugvz41OKCxOTUvNSS-NBgIwMgNDY1MDR2NDQmThUAI9YnuQ</recordid><startdate>20200723</startdate><enddate>20200723</enddate><creator>Ma, Sean</creator><creator>Cea, Stephen M</creator><creator>Morrow, Patrick</creator><creator>Keys, Patrick H</creator><creator>Weber, Justin R</creator><creator>Lilak, Aaron</creator><creator>Mehandru, Rishabh</creator><scope>EVB</scope></search><sort><creationdate>20200723</creationdate><title>VERTICALLY STACKED FINFETS &amp; SHARED GATE PATTERNING</title><author>Ma, Sean ; Cea, Stephen M ; Morrow, Patrick ; Keys, Patrick H ; Weber, Justin R ; Lilak, Aaron ; Mehandru, Rishabh</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020235013A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Ma, Sean</creatorcontrib><creatorcontrib>Cea, Stephen M</creatorcontrib><creatorcontrib>Morrow, Patrick</creatorcontrib><creatorcontrib>Keys, Patrick H</creatorcontrib><creatorcontrib>Weber, Justin R</creatorcontrib><creatorcontrib>Lilak, Aaron</creatorcontrib><creatorcontrib>Mehandru, Rishabh</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ma, Sean</au><au>Cea, Stephen M</au><au>Morrow, Patrick</au><au>Keys, Patrick H</au><au>Weber, Justin R</au><au>Lilak, Aaron</au><au>Mehandru, Rishabh</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VERTICALLY STACKED FINFETS &amp; SHARED GATE PATTERNING</title><date>2020-07-23</date><risdate>2020</risdate><abstract>Stacked finFET structures including a fin having at least a first layer of semiconductor material stacked over or under a second layer of semiconductor material. The first and second layers may include a Group IV semiconductor material layer and a Group III-V semiconductor material layer, for example. A stacked finFET may include an N-type finFET stacked over or under a P-type finFET, the two finFETs may have channel portions within the different semiconductor material layers. Channel portions of the first and second layers of semiconductor material may be coupled to separate gate electrodes that are vertically aligned. Channel portions of the first and second layers of semiconductor material may be vertically separated by subfin portions of the first and second layers. Different layers of dielectric material adjacent to the subfin portions may improve electrical isolation between the channel portions, for example as a source of fixed charge or impurity dopants.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2020235013A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title VERTICALLY STACKED FINFETS & SHARED GATE PATTERNING
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T14%3A36%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Ma,%20Sean&rft.date=2020-07-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2020235013A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true