LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING
Implementations of the disclosure are directed to a thermal via filling solder paste that exhibits little to no volume loss during reflow. The solder paste may include a solder powder such as tin-silver-copper alloy, a high melting temperature powder (e.g., a copper powder) having a higher melting t...
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| creator | Lee, Ning-Cheng Mao, Runsheng |
| description | Implementations of the disclosure are directed to a thermal via filling solder paste that exhibits little to no volume loss during reflow. The solder paste may include a solder powder such as tin-silver-copper alloy, a high melting temperature powder (e.g., a copper powder) having a higher melting temperature than the solder powder, and flux. The high melting temperature powder may be configured to have a melting temperature significantly higher than the solder powder. During reflow, the solder powder may melt and wet to the high melting temperature powder, forming intermetallic compounds that keep the via holes filled during and after reflow soldering. |
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The solder paste may include a solder powder such as tin-silver-copper alloy, a high melting temperature powder (e.g., a copper powder) having a higher melting temperature than the solder powder, and flux. The high melting temperature powder may be configured to have a melting temperature significantly higher than the solder powder. During reflow, the solder powder may melt and wet to the high melting temperature powder, forming intermetallic compounds that keep the via holes filled during and after reflow soldering.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200723&DB=EPODOC&CC=US&NR=2020230750A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200723&DB=EPODOC&CC=US&NR=2020230750A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lee, Ning-Cheng</creatorcontrib><creatorcontrib>Mao, Runsheng</creatorcontrib><title>LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING</title><description>Implementations of the disclosure are directed to a thermal via filling solder paste that exhibits little to no volume loss during reflow. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING |
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