Very Thin Embedded Trace Substrate-System in Package (SIP)

A system in package is provided comprising an embedded trace substrate having redistribution layers therein, at least one passive component mounted on one side of the embedded trace substrate and embedded in a first molding compound, at least one silicon die mounted on an opposite side of the embedd...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kent, Ian, Hu, Shou Cheng Eric, Aiyandra, Rajesh Subraya, Gutierrez, III, Ernesto, Belonio, JR., Jesus Mennen, Martin, Melvin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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