WORKPIECE HOLDING METHOD AND WORKPIECE PROCESSING METHOD

A workpiece holding method for a workpiece having a bowl-shaped warp includes a mounting step of mounting the workpiece on a holding unit having a holding surface, a suction hole opening to the holding surface, and a suction passage for making selective communication between the suction hole and a v...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ATENDIDO, Paul Vincent, MIYAGI, Yusuke
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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