SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY
A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shieldi...
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creator | Kustagi, Santosh Desai, Raghuveer Hanumanthrao Valiveti, V Murugesan, Gokul |
description | A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020187394A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020187394A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020187394A13</originalsourceid><addsrcrecordid>eNqNyj0LwjAQgOEuDqL-hwNnoR-COsb0SgNJruSuSF1qkTiJFur_Rwfdnd53eObJhTsWdKB8CQ6lphJORmqgRowzZyyhIds5DD-hLLCEVksbPqvJNeTRC0NFAdCilkDeaFDM6I62Wyaz23Cf4urbRbKuUHS9ieOzj9M4XOMjvvqW8zRPs_2uOGxVVvyn3pL9NOk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY</title><source>esp@cenet</source><creator>Kustagi, Santosh ; Desai, Raghuveer Hanumanthrao ; Valiveti, V ; Murugesan, Gokul</creator><creatorcontrib>Kustagi, Santosh ; Desai, Raghuveer Hanumanthrao ; Valiveti, V ; Murugesan, Gokul</creatorcontrib><description>A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200611&DB=EPODOC&CC=US&NR=2020187394A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200611&DB=EPODOC&CC=US&NR=2020187394A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kustagi, Santosh</creatorcontrib><creatorcontrib>Desai, Raghuveer Hanumanthrao</creatorcontrib><creatorcontrib>Valiveti, V</creatorcontrib><creatorcontrib>Murugesan, Gokul</creatorcontrib><title>SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY</title><description>A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyj0LwjAQgOEuDqL-hwNnoR-COsb0SgNJruSuSF1qkTiJFur_Rwfdnd53eObJhTsWdKB8CQ6lphJORmqgRowzZyyhIds5DD-hLLCEVksbPqvJNeTRC0NFAdCilkDeaFDM6I62Wyaz23Cf4urbRbKuUHS9ieOzj9M4XOMjvvqW8zRPs_2uOGxVVvyn3pL9NOk</recordid><startdate>20200611</startdate><enddate>20200611</enddate><creator>Kustagi, Santosh</creator><creator>Desai, Raghuveer Hanumanthrao</creator><creator>Valiveti, V</creator><creator>Murugesan, Gokul</creator><scope>EVB</scope></search><sort><creationdate>20200611</creationdate><title>SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY</title><author>Kustagi, Santosh ; Desai, Raghuveer Hanumanthrao ; Valiveti, V ; Murugesan, Gokul</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020187394A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Kustagi, Santosh</creatorcontrib><creatorcontrib>Desai, Raghuveer Hanumanthrao</creatorcontrib><creatorcontrib>Valiveti, V</creatorcontrib><creatorcontrib>Murugesan, Gokul</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kustagi, Santosh</au><au>Desai, Raghuveer Hanumanthrao</au><au>Valiveti, V</au><au>Murugesan, Gokul</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY</title><date>2020-06-11</date><risdate>2020</risdate><abstract>A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY |
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