SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY

A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shieldi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kustagi, Santosh, Desai, Raghuveer Hanumanthrao, Valiveti, V, Murugesan, Gokul
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Kustagi, Santosh
Desai, Raghuveer Hanumanthrao
Valiveti, V
Murugesan, Gokul
description A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020187394A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020187394A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020187394A13</originalsourceid><addsrcrecordid>eNqNyj0LwjAQgOEuDqL-hwNnoR-COsb0SgNJruSuSF1qkTiJFur_Rwfdnd53eObJhTsWdKB8CQ6lphJORmqgRowzZyyhIds5DD-hLLCEVksbPqvJNeTRC0NFAdCilkDeaFDM6I62Wyaz23Cf4urbRbKuUHS9ieOzj9M4XOMjvvqW8zRPs_2uOGxVVvyn3pL9NOk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY</title><source>esp@cenet</source><creator>Kustagi, Santosh ; Desai, Raghuveer Hanumanthrao ; Valiveti, V ; Murugesan, Gokul</creator><creatorcontrib>Kustagi, Santosh ; Desai, Raghuveer Hanumanthrao ; Valiveti, V ; Murugesan, Gokul</creatorcontrib><description>A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200611&amp;DB=EPODOC&amp;CC=US&amp;NR=2020187394A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200611&amp;DB=EPODOC&amp;CC=US&amp;NR=2020187394A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kustagi, Santosh</creatorcontrib><creatorcontrib>Desai, Raghuveer Hanumanthrao</creatorcontrib><creatorcontrib>Valiveti, V</creatorcontrib><creatorcontrib>Murugesan, Gokul</creatorcontrib><title>SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY</title><description>A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyj0LwjAQgOEuDqL-hwNnoR-COsb0SgNJruSuSF1qkTiJFur_Rwfdnd53eObJhTsWdKB8CQ6lphJORmqgRowzZyyhIds5DD-hLLCEVksbPqvJNeTRC0NFAdCilkDeaFDM6I62Wyaz23Cf4urbRbKuUHS9ieOzj9M4XOMjvvqW8zRPs_2uOGxVVvyn3pL9NOk</recordid><startdate>20200611</startdate><enddate>20200611</enddate><creator>Kustagi, Santosh</creator><creator>Desai, Raghuveer Hanumanthrao</creator><creator>Valiveti, V</creator><creator>Murugesan, Gokul</creator><scope>EVB</scope></search><sort><creationdate>20200611</creationdate><title>SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY</title><author>Kustagi, Santosh ; Desai, Raghuveer Hanumanthrao ; Valiveti, V ; Murugesan, Gokul</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020187394A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Kustagi, Santosh</creatorcontrib><creatorcontrib>Desai, Raghuveer Hanumanthrao</creatorcontrib><creatorcontrib>Valiveti, V</creatorcontrib><creatorcontrib>Murugesan, Gokul</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kustagi, Santosh</au><au>Desai, Raghuveer Hanumanthrao</au><au>Valiveti, V</au><au>Murugesan, Gokul</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY</title><date>2020-06-11</date><risdate>2020</risdate><abstract>A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2020187394A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T14%3A51%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kustagi,%20Santosh&rft.date=2020-06-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2020187394A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true