LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT APPARATUS
A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).
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| creator | INOUE, Hidetoshi TAKAHASHI, Hisato KAMIMURA, Tsuyoshi YOSHII, Haruyuki MATSUZAKI, Takayuki |
| description | A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D). |
| format | Patent |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT APPARATUS |
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